内蒙古快3

联系我们

DONGGUANSHIDIAIDENGSHIKEJIYOUXIANGONGSI

LIANXIREN:DAIXIANSHENG

SHOUJI:13825737907

内蒙古快3QQ:252872499

微信:13825737907

YOUXIANG:13825737907@139.com

内蒙古快3WANGZHI:weimeiled.com

内蒙古快3DIZHI:DONGGUANSHIHUANGJIANGZHENSHEBEICUNSHEBEIDADAO168HAO

LED圆片级封装技术发展及在LED照明灯具中的作用分析

您的当前位置: 首 页 >> 内蒙古快3 >> 常见问题

LED圆片级封装技术发展及在LED照明灯具中的作用分析

发布日期:2019-03-21 00:00 来源:http://weimeiled.com 点击:

   1904NIANYINGGUORENFULAIMINGFAMINGLESHIJIESHANGDIYIGEDIANZIGUAN,ZHEIBIAOZHIZHERENLEICONGCIJINRULEDIANZISHIDAI,CIHOUDIANZIGUANJISHUHUODELEGUANGFANDEYINGYONG,SHIJIESHANGDIYITAIDIANZIJISUANJI“ENIAC”JIUSHICAIYONGDIANZIGUANZHIZAODE,DANSHIRENMENZAISHIYONGZHONGFAXIANDIANZIGUANJUYOUTIJIDA、GONGHAODA、FAREDA、CHENGBENGAO、JIEGOUCUIRUO、SHOUMINGDUANDENGQUEXIAN。ZHEIJIUPOSHIRENMENYANJIUGENGXIANJINDEDIANZIYUANQIJIANDAITIDIANZIGUAN。

  1947NIAN,BEIERSHIYANSHIDEXIAOKELI、BADINGHEBULADUNFAMINGLEJINGTIGUAN,RENLEICONGCIJINRULEWEIDIANZISHIDAI。DIANZICHANPINZHONGDIANZIGUANZHUJIANBEIJINGTIGUANSUOQUDAI,JINGTIGUANCHENGWEIWEIDIANZISHIDAIDEZHULIUCHANPIN。

  ERSHISHIJILIUSHINIANDAIJICHENGDIANLUJISHUDEFAZHANSHIDEJINGTIGUANDEXIAOXINGHUACHENGWEIKENENG,ZAIDANGEXINPIANSHANGJICHENGJIBAIGEJINGTIGUANCHENGWEIXIANSHI。JINGTIGUANCHICUNDEBUDUANSUOXIAOSHIDANGEXINPIANSHANGJICHENGDEJINGTIGUANSHUMUBUDUANZENGJIA,JICHENGDIANLUDEGUIMOYECONGXIAOGUIMO(SSI),ZHUJIANFAZHANCHENGDAGUIMO、CHAODAGUIMO、SHENDAGUIMO、JIGUIMO,XIABIAOXIANSHILEJICHENGDIANLUJICHENGGUIMODEFAZHAN。

内蒙古快3  JICHENGDIANLUDEKUAISUFAZHAN,SHIXINPIANDEJICHENGDURIYITIGAO,CONGERSHIYUELAIYUEDUODECHANPINCAIYONGBANDAOTIXINPIAN。FENGZHUANGSHIBANDAOTIXINPIANZOUXIANGSHIYONGHUADEGUANJIANBUZHOU。GUANGYISHANGDEDIANZIFENGZHUANGSHIZHIDUIGEZHONGDIANZIYUANQIJIANDEFENGZHUANGHEZUZHUANG,JIBAOKUOYIJIFENGZHUANG、ERJIFENGZHUANGHESANJIFENGZHUANG。XIAYIDEDIANZIFENGZHUANGSHIZHIDUIBANDAOTIXINPIANHUOBUJIANJINXINGBAOHU。

  封装主要有四大作用:第一,保护内蒙古快3免受外界复杂环境的影响;第二,为芯片提供散热通道;第三,为芯片提供机械支撑;第四,为芯片提供电连接。自从微电子技术诞生以来,芯片设计、芯片制造以及封装和测试就成为微电子技术三个最重要的环节,业界普遍认为微电子产品总成本中,这三个环节各占三分之一。因此研究高可靠性的封装技术,对于提高产品成品率以及控制成本而言,具有重要的意义。

  ZICONG1947 NIANDIYIZHIJINGTIGUANDANSHENGZHIRIQI,FENGZHUANGYESUIZHIYINGYUNERSHENG。JINGGUO JIANGJIN70NIANDEFAZHAN,FENGZHUANGJISHUHUODELEZHANGZUDEJINBU,XIATUSUOSHIWEIFENGZHUANGJISHUFAZHANSHIYITU。

内蒙古快3  ERSHISHIJIBASHINIANDAIZHIQIAN,BANDAOTIFENGZHUANGZHUYAOCAIYONGSHUANGLIEZHICHASHIFENGZHUANGJISHU(DIP),GUANJIAOSHU4~64 GE。ZHUYAOCAIYONGCHUANKONGJISHUANZHUANGZAIDIANLUBANSHANG。FENGZHUANGMIDUDI、XIAOLVDI,NANYIMANZUZIDONGHUASHENGCHANYAOQIU。

二十世纪八十年代出现了表面贴装技术(SMT),与双列直插式封装技术相比较,表面贴装技术主要优点有:提高了封装密度;缩小了元器件尺寸缩短了引线;改善了电性能;更适应自动化生产。典型的SMT 封装技术包括方形扁平封装(QFP)和四边J形引脚扁平封装(QFJ)。

  ERSHISHIJIJIUSHINIANDAIYIHOU,YOUYURENMENDUIYUCHANPINXIAOXINGHUAYIJIGAOJICHENGDUDEYAOQIURIYIQIANGLIE,SUIZHIDANSHENGLEYIXIEXINXINGDEFENGZHUANGXINGSHI,RU:QIUZHAZHENLIEFENGZHUANG(BGA)、DAOZHUANGHAN(FC)、XINPIANCHICUNFENGZHUANG(CSP)YIJIYUANPIANJIFENGZHUANG(WLP)。ZUIJINJINIAN,YOUDANSHENGLESANWEIFENGZHUANGJISHU,ZHEIDUIYUTIGAOXITONGDEJICHENGDU、ZENGJIAFENGZHUANGMIDUJUYOUJIQIZHONGYAODEYIYI,DIANXINGDESANWEIFENGZHUANGJISHUYOUXINPIANDUIDIEJISHU、FENGZHUANGDUIDIEJISHUDENG。

  YUANPIANJIFENGZHUANGSHICAIYONGICGONGYIZAIYUANPIANSHANGJINXINGGONGYIJIAGONGBINGQIEJINXINGFENGZHUANGHECESHI,XIANGJIAOYUCHUANTONGDEFENGZHUANGJISHU,YUANPIANJIFENGZHUANG(WLP)JISHUYOUYUJUYOUJIAOWEIXIANZHUDEYOUDIAN,RUYUANPIANJIFENGZHUANGJISHUYOUJIAOXIAOFENGZHUANGMIANJI,JIANGDILEDANGEFENGZHUANGTIFENGZHUANG、LAOHUA、CESHIDEFEIYONGDENG,JINXIENIANLAIYIZHISHOUDAORENMENDEGUANZHU。

  RANER,YUANPIANJIFENGZHUANGJISHUYEYOUXUDUOKEKAOXINGWENTIXUYAOJIEJUE。BUTONGDEDUNHUACENGCAILIAO、UBMCENGDEBUJUHEHOUDUDOUHUIDUIYUANPIANJIFENGZHUANGCHANPINKEKAOXINGZAOCHENGYINGXIANG。LAOHUACESHISHIPINGDINGYUANPIANJIFENGZHUANGCHANPINKEKAOXINGDEZHONGYAOSHOUDUAN,RUHETIGAOHANQIUKANGLAOHUAXINGNENGJUYOUZHONGYAOYIYI。TONGSHI,RENMENDUILVSEHUANBAODEHUSHENGRIYIGAOZHANG,ZAOCHENGLEHANLIAOWUQIANHUAFAZHANZHEIYIBIRANQUSHI,YANJIUFAXIANWUQIANHANLIAOKANGDIELUOXINGNENGJIAOYOUQIANHANLIAOCHA,ZHEISHIDEYUANPIANJIFENGZHUANGCHANPINDIELUOKEKAOXINGYEZHIDEWOMENGUANZHU。




















               











相关标签:其它系列

在线客服
分享